ADTC & edaWorkshop26 Program

Julien Ryckaert (IMEC) 

Thomas Heurung (Siemens EDA)

Husni Habal (Infineon Technologies)

NN (ST Nano Edge Studio)

Jörg Walter (OFFIS, ISOLDE)

Saleh Mulhem (U Lübeck, ISOLDE) 

Albert Schulz (Accemic Technologies, TRISTAN)

Klaus Hofmann (TU Darmstadt, TRISTAN)

Sylvie Gellida (Starlight)

NN

Abdul Rahim (Photondelta)

Moderator: Patrick Pype (NXP)

Important Projects of Common European Interest (IPCEIs) play a vital role in strengthening European value chains and supporting the Union’s main political goals, such as the Green Deal and Digital Strategy, while also advancing sovereignty.

IPCEIs complement other research and development programs - including EFECS, Eureka, Chips JU, and Horizon Europe - by adding “First Industrial Deployment” (FID) activities to traditional R&D&I efforts.

Currently, IPCEI ME/CT (Microelectronics and Communication Technologies) represents the largest IPCEI to date, with an €8 billion funding budget and about €14 billion in private investment, involving 14 Member States and over 600 companies.

The IPCEI ME/CT program includes 4 workstreams and a spillover activity. The work-streams corresponding to the complementary technical objectives along the microelectronics value chain are: (1) sense, (2) think, (3) communicate and (4) act with spillover as an additional key activity.

Presentations of the IPCEI community:

• Introduction – what is an IPCEI?
• Looking forward, research and development communities - including students and PhD candidates - will be key in driving progress for future IPCEIs. Priority research areas will be presented based on current findings of the IPCEI ME/CT in the different workstreams. The following schedule is planned:
  • 9:20: Ferdinand Bell, NXP Semiconductors: ”Current and future view on Important Projects of Common European Interest (IPCEI)”
  • 9:40: Thomas Roedle, Infineon Technologies: “Infineon RF GaN-on-Silicon, a European high-performance, cost-efficient technology for RF power applications”
  • 10:00: Carl Henning Cabos, NXP Semiconductors: “Bosch ECU Demonstrator with NXP S32N7”
  • 10:20: Norbert Thyssen, Infineon Technologies: “Smart Power solutions enabling AI”
  • 10:40: Tomáš Bort, Mycroft Mind: “Grid Intelligence: Bridging the current IPCEI ME/CT and the future IPCEI AST"

Gilberto Rodríguez (Openchip) 

Bartek Kozicki (IMEC) 

Felix Springer (Bosch)

Abstract: 
Europe’s semiconductor ambitions are increasingly shaped not by a single instrument, but by a growing set of support mechanisms initiated by Brussels to implement the European Chips Act, such as the Chips for Europe Initiative, the European chip design platform and Design Enablement Teams (DETs), competence centres, and related funding and industrial policy measures. Together, these instruments are intended to strengthen Europe’s technological base, its design and manufacturing capabilities and further on accelerate innovation, improve resilience across the semiconductor value chain, and create better conditions for innovation, scale-up and industrial deployment.

This panel will give an overview of the current policy landscape and discuss what these initiatives mean in practice for industry, SMEs and RTOs. It will explore the technological priorities and market trends Europe should focus on to build competitiveness, strengthen strategic capabilities, and secure a strong position in the global semiconductor ecosystem.

Panelists: 

• Michael Gude (Cologne Chip)
• Patrick Pype (NXP)
• Gilberto Rodríguez (Openchip)
• Helio Fernandez Tellez (IMEC)
• Roberto Zafalon (STM)
• Arian Zwegers (DG CNECT)
   

Christian Ospelkaus (U Hannover)

Abstract:

Quantum computers have the potential to solve important problems in optimization, materials science, pharmacology, logistics, chemistry, cryptography, artificial intelligence, and other fields that are fundamentally intractable for classical computers at relevant problem scales. A leading physical implementation of quantum bits, or qubits, is based on trapped atomic ions. I will present the underlying system architecture and discuss the design and fabrication of microstructured quantum processors for trapped ions, drawing on techniques borrowed from CMOS and MEMS technologies. The presentation concludes with an overview of the current state of the technology and its remaining challenges.

Postersession of Chipdesigen Germany Forum