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Subhasish Mitra, Stanford University Abstract: Future system design methodologies must accept the fact that the underlying hardware will be imperfect, and enable design of robust systems that are resilient to such imperfections. This talk will describe enabling tools and technologies for building...

Pietro Perlo, Fiat Abstract: The electrical power-train is superior to the direct combustion based propulsion from several points of view: better overall energy efficiency, lower emissions, better fun to drive and reduced use of primary materials. The power-train of a full Electric Vehicle (EV) is...

Ulrich Schaefer, Bosch Abstract: From the expected development of the total worldwide IC market it will be shown, how the future number of needed IC designers develops during the next 15 years. A comparison with the actual number of engineering students, who are at the universities today, and...

Christian Sebeke, Bosch Abstract: More components, such as analog/radio frequency (RF), passive, high voltage (HV) power, sensor/actuator, bio-chip and micro-electro-mechanical system (MEMS) will be added to pure CMOS; processed or embedded in the chip or package instead of being added at system...

Gerd Teepe, AMD Saxony Abstract: High Performance Computing is reaching power limits. The energy bill of a computing center over its lifetime is surpassing the cost of its initial computer equipment purchase. “Performance per Watt” is now the new paradigm in compute-architectures, modes of operation...

Simon Yang, Chartered Semiconductor Manufacturing Abstract: As we arrived at the physical limits of CMOS technology, conventional scaling methodology is no longer viable to maintain the technology progress on the traditional trend characterized by Moore’s Law. On the other hand, due to the proven...

Giovanni De Micheli (EPFL) Abstract The ongoing scaling and hybridization of manufacturing technologies enables us to attain unprecedented levels of performance as well as to integrate electronic and fluidic circuits with sensors and actuators. Smart micro/nano systems will be the building blocks of...

Dominique Henoff (STMicroelectronics) Abstract: Multimedia applications are facing new challenges with embedded networking features and 3D needs, graphic and vision. These features are creating challenges in term of systems, architecture split, signal integrity, power dissipation and thermal effects...

Rolf Ernst (TU Braunschweig) Kurzbeschreibung Die hohen Softwareentwicklungskosten und die Einführung standardisierter Softwarearchitekturen, die von der konkreten Hardware abstrahieren, erwecken leicht den Eindruck, dass die Herausforderungen eingebetteter Systeme nur noch in der Software liegen...

Andreas von Schwerin (Siemens) Abstract Since the 1980s ASIC-design played an important role within Siemens for the development of industrial automation products. This is still true. Like in other industries, the main functionality of electronic products in the field of industrial automation is...