REES Workshop 2017

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DATE 2017 Logo


2nd International Workshop
on Resiliency in Embedded Electronic Systems

March 31, 2017

SwissTech Convention Center, Lausanne, Switzerland

REES 2017 Logo

General Co-Chairs
Daniel Müller-Gritschneder, Technical University of Munich, Germany
Wolfgang Müller, Heinz Nixdorf Institute/University of Paderborn, Germany
Subhasish Mitra, Stanford University CA, USA

With the sheer complexity of hardware and software systems, resiliency became a major challenge in embedded systems design, manufacturing, and operation. For industrial applications several standards such as ISO26262, IEC61508 or DO-254 prescribe a well-defined level of reliability, robustness, and fault-tolerance.

This joint academic/industry workshop addresses all resiliency aspects in hardware and software systems design and operation from different embedded system areas such as automotive, avionics, and industry automation. This includes, but is not limited to, design bugs and cross-layer and cross-domain design techniques from software (applications, operating systems, middleware) to hardware (system, architecture, circuits, device level). Of special interest are design-for-resiliency technologies, resilient-specific design flows, like integrated functional/stochastic approaches, and development frameworks for robust designs, such as virtual prototyping approaches, which support early evaluations and estimations to obtain high reliability with less cost.

REES 2017 will feature a range of highly interesting industrial invited talks.

Call for Submissions

Please find the PDF version of the call for submissions here.

Deadlines
Abstract submission deadline (1-2 pages) (Upload) Jan 15th, 2017
Author notification Feb 1st, 2017
Release of program Feb 5th, 2017 
Camera-ready  abstract March 1st, 2017
REES Workshop March 31st, 2017
Camera-Ready Proceedings Paper (2-8 pages) April 31st, 2017

 

Registration

REES 2017 will be held in conjunction with DATE 2017. Please register via the DATE 2017 website. Early registration deadline is February 15, 2017.


Proceedings

REES 2017 proceedings are published onlnie 6 weeks after the workshop

REES 2015 proceedings are available here.

Organisation

Information on Technical comittee. The workshop is supported by the DFG through the priority program Dependable Embedded Systems (SPP1500) and the BMBF through the project EffektiV.