REES Workshop 2017
2nd International Workshop
Daniel Müller-Gritschneder, Technical University of Munich, Germany
Wolfgang Müller, Heinz Nixdorf Institute/University of Paderborn, Germany
Subhasish Mitra, Stanford University CA, USA
With the sheer complexity of hardware and software systems, resiliency became a major challenge in embedded systems design, manufacturing, and operation. For industrial applications several standards such as ISO26262, IEC61508 or DO-254 prescribe a well-defined level of reliability, robustness, and fault-tolerance.
This joint academic/industry workshop addresses all resiliency aspects in hardware and software systems design and operation from different embedded system areas such as automotive, avionics, and industry automation. This includes, but is not limited to, design bugs and cross-layer and cross-domain design techniques from software (applications, operating systems, middleware) to hardware (system, architecture, circuits, device level). Of special interest are design-for-resiliency technologies, resilient-specific design flows, like integrated functional/stochastic approaches, and development frameworks for robust designs, such as virtual prototyping approaches, which support early evaluations and estimations to obtain high reliability with less cost.
REES 2017 will feature a range of highly interesting industrial invited talks.
Call for Submissions
Please find the PDF version of the call for submissions here.
|Abstract submission deadline (1-2 pages) (Upload)||Jan 15th, 2017|
|Author notification||Feb 1st, 2017|
|Release of program||Feb 5th, 2017|
|Camera-ready abstract||March 1st, 2017|
|REES Workshop||March 31st, 2017|
|Camera-Ready Proceedings Paper (2-8 pages)||April 31st, 2017|
REES 2017 proceedings are published onlnie 6 weeks after the workshop
REES 2015 proceedings are available here.