REES Workshop 2017

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DATE 2017 Logo


2nd International Workshop
on Resiliency in Embedded Electronic Systems

March 31, 2017

SwissTech Convention Center, Lausanne, Switzerland

REES 2017 Logo

General Co-Chairs
Daniel Müller-Gritschneder, Technical University of Munich, Germany
Wolfgang Müller, Heinz Nixdorf Institute/University of Paderborn, Germany
Subhasish Mitra, Stanford University CA, USA

 

The REES workshop is a joint academic/industry forum considering multiple resiliency aspects from software to hardware and  from embedded systems to chip level designs.

Program

REES 2017 features a range academic talks with poster presentations from internal research groups as well as exciting industrial presentations from ARM Limited, NXP, Bosch GmbH, Hewlett Packard Enterprise, ST Microelectronics, Infineon Technologies, and Mentor Graphics. The final program is now available at https://www.edacentrum.de/rees/program

Registration

The workshop registration is through the official DATE conference registration: https://www.date-conference.com/registration For your participation please select W05 in the Friday Workshop section. The registration fee is CHF 250 until 15th Feb and CHF 310 after 15th Feb. 

Deadlines
Abstract submission deadline (1-2 pages) (Upload) Jan 15th, 2017
Author notification NEW: Feb 6th, 2017
Release of program (Program) NEW: Feb 7th, 2017 
Camera-ready  abstract NEW: March 6th, 2017
REES Workshop
(Program, Download draft proceedings)
March 31st, 2017
Camera-Ready Proceedings Paper (2-8 pages) April 31st, 2017

Proceedings (Current and past events)

Organisation

Information on Technical comittee. The workshop is supported by the DFG through the priority program Dependable Embedded Systems (SPP1500) and the BMBF through the project EffektiV.