REES Workshop 2017
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2nd International Workshop
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General Co-Chairs
Daniel Müller-Gritschneder, Technical University of Munich, Germany
Wolfgang Müller, Heinz Nixdorf Institute/University of Paderborn, Germany
Subhasish Mitra, Stanford University CA, USA
The REES workshop is a joint academic/industry forum considering multiple resiliency aspects from software to hardware and from embedded systems to chip level designs.
Program
REES 2017 features a range academic talks with poster presentations from internal research groups as well as exciting industrial presentations from ARM Limited, NXP, Bosch GmbH, Hewlett Packard Enterprise, ST Microelectronics, Infineon Technologies, and Mentor Graphics. The final program is now available at https://www.edacentrum.de/rees/program
Registration
The workshop registration is through the official DATE conference registration: https://www.date-conference.com/registration For your participation please select W05 in the Friday Workshop section. The registration fee is CHF 250 until 15th Feb and CHF 310 after 15th Feb.
| Abstract submission deadline (1-2 pages) (Upload) | Jan 15th, 2017 |
| Author notification | NEW: Feb 6th, 2017 |
| Release of program (Program) | NEW: Feb 7th, 2017 |
| Camera-ready abstract | NEW: March 6th, 2017 |
| REES Workshop (Program, Download draft proceedings) |
March 31st, 2017 |
| Camera-Ready Proceedings Paper (2-8 pages) | April 31st, 2017 |
Proceedings (Current and past events)
- REES 2017 draft proceedings available: Download REES 2017 draft proceedings . Final proceedings are published online 6 weeks after the workshop
- REES 2015 final proceedings available: Download REES 2015 final proceedings.
Organisation
Information on Technical comittee. The workshop is supported by the DFG through the priority program Dependable Embedded Systems (SPP1500) and the BMBF through the project EffektiV.
