REES Workshop 2017


2nd International Workshop
on Resiliency in Embedded Electronic Systems

March 31, 2017

SwissTech Convention Center, Lausanne, Switzerland

General Co-Chairs
Daniel Müller-Gritschneder, Technical University of Munich, Germany
Wolfgang Müller, Heinz Nixdorf Institute/University of Paderborn, Germany
Subhasish Mitra, Stanford University CA, USA

 

The REES workshop is a joint academic/industry forum considering multiple resiliency aspects from software to hardware and  from embedded systems to chip level designs.

With the sheer complexity of hardware and software systems, resiliency became a major challenge in embedded systems design, manufacturing, and operation. For industrial applications several standards such as ISO26262, IEC61508 or DO-254 prescribe a well-defined level of reliability, robustness, and fault-tolerance.

This joint academic/industry workshop addresses all resiliency aspects in hardware and software systems design and operation from different embedded system areas such as automotive, avionics, and industry automation. This includes, but is not limited to, design bugs and cross-layer and cross-domain design techniques from software (applications, operating systems, middleware) to hardware (system, architecture, circuits, device level). Of special interest are design-for-resiliency technologies, resilient-specific design flows, like integrated functional/stochastic approaches, and development frameworks for robust designs, such as virtual prototyping approaches, which support early evaluations and estimations to obtain high reliability with less cost.

Program

REES 2017 features a range academic talks with poster presentations from internal research groups as well as exciting industrial presentations from ARM Limited, NXP, Bosch GmbH, Hewlett Packard Enterprise, ST Microelectronics, Infineon Technologies, and Mentor Graphics. The final program is now available at https://www.edacentrum.de/rees/program

Registration

The workshop registration is through the official DATE conference registration: https://www.date-conference.com/registration For your participation please select W05 in the Friday Workshop section. The registration fee is CHF 250 until 15th Feb and CHF 310 after 15th Feb. 

REES 2017 will feature a range of highly interesting industrial invited talks.

Full Program is Online (Program)

Call for Submissions

Please find the PDF version of the call for submissions here.

 

Interested contributors are invited to submit an extended abstract with the description and the status of their work including clear references to already published articles or reports. Extended abstract are requested in PDF format following the IEEE manuscript templates for conference proceedings available at the IEEE website. Authors can upload their extended abstract (1-2 pages) in the upload section. Authors should be prepared for an oral presentation and for a discussion in front of their poster after their session. The official workshop proceedings will become available 4 weeks after the workshop. Organizers plan to organize a special journal issue for the publication of selected papers.

-->Deadlines

Abstract submission deadline (1-2 pages) (Upload)Jan 15th, 2017Author notificationNEW: Feb 6th, 2017Release of program (Program)NEW: Feb 7th, 2017  Camera-ready  abstractNEW: March 6th, 2017REES Workshop
(Program, Download draft proceedings)March 31st, 2017Camera-Ready Proceedings Paper (2-8 pages)April 31st, 2017

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Proceedings (Current and past events)

Organisation

Information on Technical comittee. The workshop is supported by the DFG through the priority program Dependable Embedded Systems (SPP1500) and the BMBF through the project EffektiV.