Toward Open Automotive Chiplets: Reliability, Affordability, and 2.5D/3D Integration

Bartek Kozicki, IMEC

Abstract

Chiplets are evolving from a packaging option to become the foundation for a scalable compute ecosystem. This talk explores how to build an interoperable chiplet ecosystem for high performance automotive central compute, beyond the hard limits of cost, reticle size, power, and memory bandwidth. We will highlight the key enabling 2.5D/3D packaging technologies and the pathway toward reliability, affordability, and interoperability needed to move from today’s closed stacks toward an open chiplet market.

Curriculum Vitae

Bartek Kozicki is a Program Director at imec’s Connected Computing division, responsible for digital architectures. In his role he shapes research strategy, defines technology roadmaps, and drives technology transfer. 
Before imec, his career includes strategy and technology leadership roles at Nokia Bell Labs with focus on next-generation communication technologies, hardware accelerator design, and cloud-native RAN. Earlier, he worked as an Associate Researcher at NTT Innovation Labs on optical network systems.
He holds a PhD from Osaka University, Japan, and has authored 50+ publications and 20+ patents.