Authors: Monica Rafaila, Infineon Technologies AG, DE; ; Georg Pelz, Infineon Technologies AG, DE; Andi Buzo (Infineon Technologies AG); Anamaria Oros (Technical University of Cluj-Napoca); Ingrid Kovacs (Technical University of Cluj-Napoca); Marina Topa (Technical University of Cluj-Napoca)
Zusammenfassung:
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
24-27 Oct. 2013
Publication Date: 2013/10/25
Location of Publication: IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME), Galati, Romania
Keyword: Automotive
