EE Times 40th Anniversary: From 3-D chips to cognitive computing

Someday My 3-D Princess Will Come

3-D chips are one of those perennially "almost there" technologies, but are bound to become commonplace by 2023. Between now and then the 2.5-D Interposers will provide a buffer that solves the same problems without the fabrication headaches. Interposers interconnect multiple 2-D die on a silicon substrate that rivals stacking die in speed and energy conservation, but which lays them out side-by-side like a traditional PC board, only smaller. However, by 2023 stacked die using through-silicon-vias (TSVs) will be commonplace, such as the Hybrid Memory Cube (HMC) developed by Micron. Initially the bottom logic layer will be manufactured by IBM and shipped to Micron for stacking memory die. The HMC is being promoted by a consortium whose members include Altera, ARM, HP, IBM, Micron, Microsoft, Open Silicon, Samsung, SK Hynix and Xilinx.