Deformation and Topography for Electronic

Authors: Thomas Fries, FRT GmbH, DE; B. Tröger (FRT); B. Richarz (FRT); M. Hildebrandt (FHG); R. Dudek (FHG); S. Rzepka (FHG); L. Scheiter (CWM); E. Noack (CWM); B. Seiler (CWM)

Devices under Thermal Load

Zusammenfassung:

Presentation of TRACE project partners Fries, Fraunhofer ENEAS, and CWM, held at the 4th European Expert Workshop on Reliability of Electronics and Smart Systems (EuWoRel), October 18-19 2016 at Fraunhofer Forum.

Publication Date: 2016/10/18

Location of Publication: Fraunhofer Forum

Keywords: Automotive; Test

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