|
2010/12/01 - 13:49 |
NEEDS Projekt zum 1.12.2010 gestartet |
|
2011/03/01 - 13:51 |
Projektflyer steht zum Download bereit |
|
2011/03/04 - 17:02 |
Erfolgreiches NEEDS KickOff hat am 4.3.2011 in München stattgefunden |
|
2011/04/11 - 08:52 |
Test Issues for 3D Chips (DAC Blog, 7.4.2011) |
|
2011/04/20 - 09:04 |
Design for 3D Silicon Integration Workshop Ende Juni in Grenoble |
|
2011/05/24 - 13:39 |
Imec and Atrenta develop exploration flows for 3D ICs |
|
2012/02/02 - 11:43 |
Wanted: 3-D IC standards within six months |
|
2012/02/02 - 12:01 |
CEA-Leti launches Open 3D initiative to include design, layout, testing and packaging |
|
2012/04/13 - 09:59 |
Synopsys 3D-IC-lnitiative |
|
2012/04/17 - 15:16 |
EDPS: 3D ICs |
