REES Workshop 2017 - Technical Committee

• Wolfgang Ecker, Infineon Technologies AG, Germany
• Luc van Dijk, NXP, Netherlands
• Dip Goswami, TU Eindhoven, Netherlands
• Masahiro Fujita, University of Tokyo, Japan
• Andreas Gerstlauer, University of Texas at Austin, USA
• Michael Glass, University of Ulm, Germany
• Daniel Große, University of Bremen, Germany
• Wolfgang Kunz, TU Kaiserslautern, Germany
• Smail Niar,Universite de Valenciennes, France
• Jan-Hendrick Oetjens, Bosch, Germany
• Alexander Viehl, FZI, Germany
• Christian Weis, TU Kaiserslautern, Germany

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